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Pathways of advanced 3D integration based on two-dimensional materials

摘要 The relentless pursuit of higher performance,greater energy efficiency,and enhanced functional diversity in comput-ing hardware,driven by applications in artificial intelligence,edge computing,and sensor networks,has intensified the need for advanced integration technologies.

doi： 10.1088/1674-4926/26020039

刊名半导体学报（英文版） ISTICEI

年，卷(期)： 2026, 47(9)

机标分类号： G250.76 U491 F224.0

在线出版日期： 2026年10月12日

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