Lightweight diamond/Cu interface tuning for outstanding heat conduction
摘要
With rapid developments in the field of very large-scale integrated circuits,heat dissipation has emerged as a significant factor that restricts the high-density integration of chips.Due to their high thermal conductivity and low thermal expansion coefficient,diamond/Cu composites have attracted considerable attention as a promising thermal management material.In this study,a surface tungsten carbide gradient layer coating of diamond particles has been realized using comprehensive magnetron sputtering technology and a heat treatment process.Diamond/Cu composites were prepared using high-temperature and high-pressure technology.The results show that,by adjusting the heat treatment process,tungsten carbide and di-tungsten carbide are generated by an in situ reaction at the tungsten-diamond interface,and W-WC-W2C gradient layer-coated diamond particles were obtained.The diamond/Cu composites were sintered by high-temperature and high-pressure technology,and the density of surface-modified diamond/Cu composites was less than 4 g cm-3.The W-WC-W2C@diamond/Cu composites have a thermal diffusivity as high as 331 mm2 s-1,and their thermal expansion coefficient is as low as 1.76×10-6 K-1.The interface coherent structure of the gradient layer-coated diamond/copper composite can effectively improve the interface heat transport efficiency.
Author：
Wenjie Dou
Congxu Zhu
Xiwang Wu
Xun Yang
Wenjun Fa
Yange Zhang
Junfeng Tong
Guangshan Zhu
Zhi Zheng
作者单位：
Henan Key Laboratory of Diamond Optoelectronic Materials and Devices,Key Laboratory of Materials Physics,Ministry of Education,School of Physics and Microelectronics,Zhengzhou University,Zhengzhou,China
Key Laboratory of Micro-Nano Materials for Energy Storage and Conversion of Henan Province,College of Chemical and Materials Engineering,Xuchang University,Xuchang,China
Work-Station of Zhongyuan Scholars of Henan Province,Henan Huanghe Whirlwind Co.Ltd.,Changge,China
Key Laboratory of Polyoxometalate and Reticular Material Chemistry of Ministry of Education,Northeast Normal University,Changchun,China
年，卷(期)：
2023, 5(12)
机标分类号：
TP311
G633.67
O76
在线出版日期：
2024年4月25日
